Mixx Technologies Inc, a deep-tech startup, announced the successful closure of a $33 million Series A funding round. The financing was led by ICM HPQC Fund, with participation from TDK Ventures, Systemiq Capital, Banpu Innovation & Ventures, G Vision Capital, Ajinomoto Group Ventures, AVITIC Innovation Fund, and other strategic partners.
Mixx was founded by the innovators behind Intel’s silicon photonics-based transceivers and Broadcom’s industry-first co-packaged optics (CPO) for network switches. “The team has been at the forefront of every major leap in connectivity and is now uniting to eliminate the interconnect bottleneck that constrains performance and scalability of artificial intelligence. With a platform that merges photonics, advanced packaging, and system architecture, Mixx is building the foundation for faster and more parallelized AI infrastructure,” the company said in a statement.
The capital will be used to advance Mixx’s product development milestones, expand its global footprint, and scale R&D centers in the U.S., India, and Taiwan, alongside continued investment in its strategic collaborations with ecosystem partners.
“As AI infrastructure scales into the exabyte era, the very metrics of performance are shifting.” said Vivek Raghuraman, CEO and Co-Founder of Mixx Technologies. “What once centered on link speeds and component efficiency must now account for system-wide power, latency, and reliability measured at the data center level. Mixx is rethinking these fundamentals to optimize end-to-end data movement, where every pico-joule saved and nanosecond gained compounds across trillions of interconnected nodes.”
At the heart of this shift is HBxIO, a silicon-integrated optical engine that forms a communication platform for next-generation AI infrastructure, Mixx stated. Combined with open standards, proprietary orchestration algorithms, and a high-radix connector, this advanced architecture bridges the compute demands of the back-end and front-end network with unprecedented speed and reliability. By delivering higher bandwidth, lower power consumption, and reduced total cost of ownership, Mixx is redefining the connectivity fabric needed to realize the full potential of tomorrow’s intelligent systems.
Rebecca Schaevitz, Co-Founder and Chief Product Officer at Mixx added, “We are transforming the path from transistor to fiber with silicon-integrated optics, flattening the network and eliminating bottlenecks at the core. Our connectivity fabric is engineered to scale as aggressively as modern AI compute.”
“TDK Ventures invests in companies driving sustainable technological transformation at scale,” said Tina Tosukhowong, Investment Director at TDK Ventures. “Mixx’s pragmatic approach makes manufacturability seamless for the AI era—enabling a multi-generation roadmap for performance improvement and energy efficiency gains, both critical for the growth of hyperscale infrastructure.”